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High-sensitivity low-energy thermal aware system for next generation integrated systems

Background In next-generation integrated systems, high power densities and thermal issues can dramatically degrade performance, reliability, leakage current, and system robustness. Allocating heat conduction paths and specialized cooling systems can help protect from overheating, but these systems must be supported with a temperature aware capability...

Published: 5/23/2023 | Inventor(s): Eby Friedman, Abdelrahman Qoutb

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Category(s): Computer Hardware